DDR2 UNBUFFERED SDRAM DIMM PC2 6400 and PC2 8500
BL12864AA80A
BL25664AA80A
BL12864AA106A
BL25664AA80A
BL12864AA106A
What is Ballistix memory?
The Ballistix line is specifically built for performance enthusiasts who want to push the performance envelope without worrying about data loss or corruption, mysterious intermittent errors and display problems, or worse — the dreaded BSOD! The Ballistix line of high-performance memory modules features advanced speed grades, low latencies, and integrated aluminum heat spreaders.
What is a Ballistix 240-pin DIMM?
A Ballistix dual inline memory module (DIMM) consists of a number of memory components that are attached to a black printed circuit board. The gold pins on the bottom of the DIMM provide a connection between the module and a socket on a larger printed circuit board. The pins on the front and back of a DIMM are not connected to each other.
Ballistix 240-pin DIMMs are used to provide DDR2 SDRAM memory for desktop computers. DDR2 is a leading-edge generation of memory with an improved architecture that allows it to transmit data very fast. Ballistix 240-pin DIMMs are available in DDR2 PC2-5300 SDRAM (DDR2 667), DDR2 PC2-6400 (DDR2 800), and DDR2 PC2-8500 (DDR2 1066).
To use DDR2 memory, your system motherboard must have 240-pin DIMM slots and a DDR2-enabled chipset. A DDR2 SDRAM DIMM will not fit into a standard SDRAM DIMM socket or a DDR DIMM socket.
Features
• 240-pin dual in-line memory module (DIMM)
• Fast data transfer rates: PC2-8500 or PC2-6400
• 1GB (128 Meg x 64) and 2GB (256 Meg x 64)
• Exclusively designed for high-performance systems
• Critical performance parameters tested for
functionality
• Speed verification performed in-system
• VDD = +2.0V ±0.1V, VDDQ = +2.0V ±0.1V
• VDDSPD = +1.7V to +3.6V
• Differential data strobe (DQ, DQS#) option
• Four-bit prefetch architechture
• Auto Refresh (CBR) and Self Refresh Mode
• 7.8125 s maximum average periodic refresh interval
• 64ms, 8,192-cycle refresh
• On-die termination (ODT)
• Serial Presence Detect (SPD) with EEPROM
• Gold edge contacts
• Aluminum heat spreader
• 1.18” (30mm) PCB Height
Timing Parameters
Module Module Latency
Marking Bandwidth (CL - tRCD - tRP - tRAS)
106A 8.5 GB/s 5 - 5 - 5 - 15 *
80A 6.4 GB/s 4 - 4 - 4 - 12 *
Module Memory Clock/ Banking Component
Part Number Density Data Bit Rate Configuration Configuration
Guide created: 16/08/09 (updated 13/10/09)

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